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EVERLIGHT ELECTRONICS CO.,LTD.
IRM-H538/TR2
Recommended method of storage
Dry box storage is recommended as soon as the aluminum bag has been opened prevent
moisture absorption. The following conditions should be observed, if dry boxes are not available:
Storage temperature 10 ℃ to 30 ℃
Storage humidity ≦ 60%RH max.
After more than 72 hours under these conditions moisture content will be too high for
Reflow soldering:
In case of moisture absorption, the devices will recover to former condition by drying
under the following condition:
192 hours at 40 ℃ +5 ℃ /-0 ℃ and 5%RH (dry air / nitrogen) or
96 hours at 60 ℃ +5 ℃ and < 5%RH for all device containers or
24 hours at 125 ℃ +5 ℃ not suitable for reel or tubes.
ESD Precaution
Proper storage and handing procedures should be followed to prevent ESD damage to
the devices especially when they are removed from the Anti-static bag. Electro-Static Sensitive
Devices warning labels are on the packing.
Recommended Solder Profile
1~5°C/sec
Pre-heating
60sec. Max.
260°C Max.
10sec Max.
1~5°C/sec.
180~200°C
Above. 220°C
120sec.Max.
Notice:
(1) Reflow soldering should not be done more than two times.
(2) When soldering, do not put stress on the IRM-H538/TR1 Series devices during heating.
(3) After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev
1
Page: 9 of 12
Device No
DMO-538-400
Prepared date
11-24-2006
Prepared by Cindy Lin
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